No submissions about hardware news, rumors, or reviews.Please keep in mind that we are here to help you build a computer, not to build it for you. As a result of the gaps the amount of heat pipes touching the center of the IHS is lower and their surface area is lower, reducing the heat sink's efficiency.Submit Build Help/Ready post Submit Troubleshooting post Submit other post New Here? BuildAPC Beginner's Guide Live Chat on Discord Daily Simple Questions threads Gaps between heat pipes result in uneven heat distribution which can create or worsen hot spots on the CPU. As a result the IHS and CPU below it get cooled more evenly, and more heat pipes can be packed in small space improving cooling performance. Thanks to high precision machinery several heat pipes can be combined into a tightly packed virtual vapor chamber array with a perfectly flat and uniform surface.
Includeds a new 120mm PWM fan with anti-vibration rubber pads and a quick snap cover for an easily expedited fan installation. Supports an optional 2nd 120mm fan to increase cooling performance.ġ20mm PWM fam with quick snap fan bracket design Patented CDC™ (Continuous Direct Contact) technology, side-by-side heat pipe configurations with no gaps creating a perfectly smooth surface for heat conduction.Ĭompatible with Intel® LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150 & AMD Socket FM1 / FM2 / AM3+ / AM3 / AM2+ / AM2
The aluminum fin structure has been optimized to provide the perfect performance balance between high and low speed fan operations. This acts as a virtual vapor chamber that dissipates a large amount of heat. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact™ (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. The Hyper 212 EVO cooling systems are designed and optimized to provide the best user experience and cooling potential for a new generation of processors.
0 kommentar(er)
